AMKR Share Price

Open 11.09 Change Price %
High 11.80 1 Day 0.48 4.33
Low 11.03 1 Week 0.00 0.00
Close 11.57 1 Month 0.69 6.34
Volume 1977690 1 Year 0.07 0.61
52 Week High 12.48
52 Week Low 8.32
AMKR Important Levels
Resistance 2 12.28
Resistance 1 11.99
Pivot 11.47
Support 1 11.15
Support 2 10.86
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Amkor Technology, Inc. (NASDAQ: AMKR)

AMKR Technical Analysis 5
As on 31st Oct 2017 AMKR Share Price closed @ 11.57 and we RECOMMEND Strong Buy for LONG-TERM with Stoploss of 10.50 & Strong Buy for SHORT-TERM with Stoploss of 9.85 we also expect STOCK to react on Following IMPORTANT LEVELS.
AMKR Target for June
1st Target up-side 12.38
2nd Target up-side 12.94
3rd Target up-side 13.51
1st Target down-side 10.76
2nd Target down-side 10.2
3rd Target down-side 9.63
AMKR Other Details
Segment EQ
Market Capital 675129984.00
Sector Technology
Industry Semiconductor - Integrated Circuits
Offical website
AMKR Address
1900 South Price Road
Chandler, AZ 85286
United States
Phone: 480-821-5000
Fax: 480-821-8276
AMKR Latest News
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AMKR Business Profile
Amkor Technology, Inc. (Amkor) is a provider of outsourced semiconductor packaging (assembly) and test services. The Company offers a range of packaging and test technologies and services. Its packages are designed based on application and chip specific requirements, including the type of interconnection technology employed, size, thickness, and electrical, mechanical and thermal performance. It provides turnkey packaging and test solutions, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, assembly, test and drop shipment services. It provides a range of test engineering services from test program development to full product characterization for radio frequency mixed signal, logic and memory devices. Amkor is a provider of radio frequency test services. In July 2013, the Company completed the acquisition of Toshiba Corp’s wholly owned subsidiary Toshiba Electronics Malaysia Sdn. Bhd., which is engaged in semiconductor packaging operation in Malaysia. The Company's customers include Altera Corporation, Broadcom Corporation, Infineon Technologies AG, International Business Machines Corporation (IBM), LSI Corporation, Qualcomm Incorporated, Sony Corporation, ST Microelectronics, Pte., Texas Instruments, Inc. and Toshiba Corporation. As of December 31, 2010, it had approximately 225 customers. The Company offers a range of package formats and services designed to provide its customers with a range of packaging solutions. Its package services are divided into three families: chip scale package, ball grid array, and leadframe. It also provides other packaging services, such as wafer bumping, which supports its flip chip and wafer-level packages. Its chip scale package family also includes system-in-package modules, which integrate two or more chips and passive device elements into a single package. Ball grid array packages are form factor substrate-based packages. Ball grid array packages are used for networking, storage, gaming, computing and consumer applications.