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Amkor Technology Inc (NASDAQ: AMKR)

 
AMKR Technical Analysis
4
As on 9th Jun 2023 AMKR SHARE Price closed @ 25.88 and we RECOMMEND Buy for LONG-TERM with Stoploss of 20.64 & Strong Buy for SHORT-TERM with Stoploss of 22.78 we also expect STOCK to react on Following IMPORTANT LEVELS.
 
 

AMKRSHARE Price

Open 26.64 Change Price %
High 26.64 1 Day -0.63 -2.38
Low 25.76 1 Week 1.10 4.44
Close 25.88 1 Month 3.82 17.32
Volume 1168818 1 Year 3.28 14.51
52 Week High 31.03 | 52 Week Low 15.44
 
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AMKR
Daily Charts
AMKR
Intraday Charts
Whats New @
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AMKR
Free Analysis
 
AMKR Important Levels Intraday
RESISTANCE27.58
RESISTANCE27.03
RESISTANCE26.70
RESISTANCE26.36
SUPPORT25.40
SUPPORT25.06
SUPPORT24.73
SUPPORT24.18
 
AMKR Forecast April 2024
4th UP Forecast36.81
3rd UP Forecast33.3
2nd UP Forecast31.14
1st UP Forecast28.97
1st DOWN Forecast22.79
2nd DOWN Forecast20.62
3rd DOWN Forecast18.46
4th DOWN Forecast14.95
 
AMKR Weekly Forecast
4th UP Forecast32.59
3rd UP Forecast30.44
2nd UP Forecast29.11
1st UP Forecast27.78
1st DOWN Forecast23.98
2nd DOWN Forecast22.65
3rd DOWN Forecast21.32
4th DOWN Forecast19.17
 
AMKR Forecast2024
4th UP Forecast57.66
3rd UP Forecast47.47
2nd UP Forecast41.17
1st UP Forecast34.87
1st DOWN Forecast16.89
2nd DOWN Forecast10.59
3rd DOWN Forecast4.29
4th DOWN Forecast-5.9
 
 
AMKR Other Details
Segment EQ
Market Capital 5409776128.00
Sector Technology
Industry Semiconductors
Offical website >
 
AMKR Address
AMKR
 
AMKR Latest News
 
Your Comments and Response on Amkor Technology Inc
 
AMKR Business Profile
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona. Address: 2045 East Innovation Circle, Tempe, AZ, United States, 85284
 
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