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Applied Materials, Inc. (NASDAQ: AMAT)
AMAT Technical Analysis
5
| As on 31st Oct 2017 AMAT Share Price closed @ 56.43 and we RECOMMEND Strong Buy for LONG-TERM with Stoploss of 41.59 & Strong Buy for SHORT-TERM with Stoploss of 49.19 we also expect STOCK to react on Following IMPORTANT LEVELS. |
AMAT Share Price
| Open | 56.05 | Change | Price | % |
| High | 56.68 | 1 Day | 0.53 | 0.95 |
| Low | 55.69 | 1 Week | 0.00 | 0.00 |
| Close | 56.43 | 1 Month | 2.49 | 4.62 |
| Volume | 7406735 | 1 Year | 27.61 | 95.80 |
| 52 Week High 56.82 | 52 Week Low 28.93 | ||||
NASDAQ USA Most Active Stocks
| YHOO | 52.58 | 0.00% |
| FNFG | 10.18 | -0.20% |
| DELL | 13.86 | 0.22% |
| RFMD | 16.59 | -2.07% |
| MU | 44.31 | 6.39% |
| RIMM | 13.03 | 0.39% |
| BBEP | 0.12 | 0.00% |
| GTAT | 0.44 | 0.00% |
| SUSQ | 14.20 | -0.77% |
| INTC | 45.49 | 2.52% |
NASDAQ USA Top Gainers Stocks
NASDAQ USA Top Losers Stocks
| AMAT Daily Charts |
AMAT Intraday Charts |
Whats New @ Bazaartrend |
AMAT Free Analysis |
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AMAT Important Levels Intraday
| SUPPORT | 0.00 |
| SUPPORT | 0.00 |
| RESISTANCE | 57.35 |
| RESISTANCE | 56.97 |
| SUPPORT | 55.89 |
| SUPPORT | 55.51 |
| SUPPORT | 0.00 |
| SUPPORT | 0.00 |
AMAT Target for Month February
| 4th UP TARGET | 68.09 |
| 3rd UP TARGET | 64.35 |
| 2nd UP TARGET | 62.04 |
| 1st UP TARGET | 59.73 |
| 1st DOWN TARGET | 53.13 |
| 2nd DOWN TARGET | 50.82 |
| 3rd DOWN TARGET | 48.51 |
| 4th DOWN TARGET | 44.77 |
AMAT Weekly Target
| 4th UP TARGET | 0.00 |
| 3rd UP TARGET | 0.00 |
| 2nd UP TARGET | 0.00 |
| 1st UP TARGET | 0.00 |
| 1st DOWN TARGET | 0.00 |
| 2nd DOWN TARGET | 0.00 |
| 3rd DOWN TARGET | 0.00 |
| 4th DOWN TARGET | 0.00 |
AMAT Target for Year 2019
| 4th UP TARGET | 0 |
| 3rd UP TARGET | 0 |
| 2nd UP TARGET | 0 |
| 1st UP TARGET | 0 |
| 1st DOWN TARGET | 0 |
| 2nd DOWN TARGET | 0 |
| 3rd DOWN TARGET | 0 |
| 4th DOWN TARGET | 0 |
Applied Materials, Inc. ( NASDAQ USA Symbol : AMAT )
Sector : Technology And Other Stocks in Same Sector
Sector : Technology And Other Stocks in Same Sector
AMAT Other Details
| Segment | EQ | |
| Market Capital | 14181694464.00 | |
| Sector | Technology | |
| Industry | Semiconductor Equipment & Materials | |
| Offical website | http://www.appliedmaterials.com | |
AMAT Address
 |
3050 Bowers Avenue PO Box 58039 Santa Clara, CA 95052 United States Phone: 408-727-5555 Fax: 408-748-9943 |
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AMAT Latest News
AMAT Business Profile
Applied Materials, Inc. (Applied), incorporated on March 18, 1987, provides manufacturing equipment, services and software to the global semiconductor, flat panel display, solar photovoltaic (PV) and related industries. Applied’s customers include manufacturers of semiconductor wafers and chips, flat panel liquid crystal displays (LCDs), solar PV cells and modules, and other electronic devices. These customers may use what they manufacture in their own end products or sell the items to other companies for use in advanced electronic components. Applied operates in four segments: Silicon Systems Group, Applied Global Services, Display, and Energy and Environmental Solutions. In November 2011, the Company acquired Varian Semiconductor Associates, Inc.
Applied’s Silicon Systems Group segment develops, manufactures and sells a range of manufacturing equipment used to fabricate semiconductor chips, also referred to as integrated circuits (ICs). Most chips are built on a silicon wafer base and include a range of circuit components, such as transistors and other devices, that are connected by multiple layers of wiring (interconnects).
Applied offers systems that perform most of the primary processes used in chip fabrication, including atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), rapid thermal processing (RTP), chemical mechanical planarization (CMP), wet cleaning and wafer metrology and inspection, as well as systems that etch, measure and inspect circuit patterns on masks used in the photolithography process. Applied’s semiconductor manufacturing systems are used by integrated device manufacturers and foundries to build and package memory, logic and other types of chips.
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