S24 Share Price

Open 0.47 Change Price %
High 0.47 1 Day 0.00 0.00
Low 0.46 1 Week 0.00 0.00
Close 0.46 1 Month 0.00 0.00
Volume 180800 1 Year 0.00 0.00
52 Week High 1.17
52 Week Low 0.81
S24 Important Levels
Resistance 2 0.47
Resistance 1 0.47
Pivot 0.46
Support 1 0.45
Support 2 0.45
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STATS ChipPAC Ltd (SGX: S24)

S24 Technical Analysis 4
As on 27th Aug 2015 S24 Share Price closed @ 0.46 and we RECOMMEND Sell for LONG-TERM with Stoploss of 0.48 & Strong Sell for SHORT-TERM with Stoploss of 0.46 we also expect STOCK to react on Following IMPORTANT LEVELS.
S24 Target for June
1st Target up-side N/A
2nd Target up-side N/A
3rd Target up-side N/A
1st Target down-side N/A
2nd Target down-side N/A
3rd Target down-side N/A
S24 Other Details
Segment EQ
Market Capital 0.00
Sector Technology
Industry Semiconductor Equipment & Materials
Offical website http://www.statschippac.com
S24 Address
10 Ang Mo Kio Street 65
No 05-17/20 Techpoint
Singapore, 569059
Phone: 65 6824 7777
Fax: 65 6720 7829
S24 Latest News
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S24 Business Profile
STATS ChipPAC Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for communications, digital consumer, and computing market applications. Its services include post wafer fab process, and back-end assembly and test. The company offers wafer bumping for both 200mm and 300mm wafer sizes in a range of options, including printed bump, ball drop, and plated technology with eutectic, high lead, lead free, and copper column alloys. The company’s wafer bumping offering includes wafer bump and redistribution, turnkey services for advanced flip chip applications, and turnkey services for wafer level chip scale packages. The company’s packaging services support various package technologies, including wafer level products; flip chip packages; copper wirebond packages; ball grid array and fine pitch ball grid array packages; quad flat no-lead and bump chip carrier packages; quad flat pack and thin small outline packages; system-in-package; 3D packages; and memory cards. It also provides a suite of solutions and test platforms comprising test facilities, test platforms, wafer sort, test development services, RF test, mixed signal test, memory test, high-end digital test, strip test, final test, and post test solutions, as well as integrated test management system. In addition, it provides warehousing, drop shipment, administration, and research services. The company markets its services through direct sales force in the United States, South Korea, Japan, China, Singapore, Malaysia, Taiwan, and Switzerland. STATS ChipPAC Ltd. was founded in 1994 and is headquartered in Singapore. STATS ChipPAC Ltd. operates as a subsidiary of Singapore Technologies Semiconductors Pte Ltd.