SPIL Share Price

Open 7.31 Change Price %
High 7.37 1 Day 0.04 0.55
Low 7.28 1 Week -0.20 -2.65
Close 7.36 1 Month 0.00 0.00
Volume 104392 1 Year 0.50 7.29
52 Week High 8.36
52 Week Low 0.00
SPIL Important Levels
Resistance 2 7.44
Resistance 1 7.41
Pivot 7.34
Support 1 7.31
Support 2 7.28
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Siliconware Precision Industries Company, Ltd. (NASDAQ: SPIL)

SPIL Technical Analysis 3
As on 2nd Dec 2016 SPIL Share Price closed @ 7.36 and we RECOMMEND Sell for LONG-TERM with Stoploss of 7.52 & Sell for SHORT-TERM with Stoploss of 7.39 we also expect STOCK to react on Following IMPORTANT LEVELS.
SPIL Target for December
1st Target up-side 7.78
2nd Target up-side 7.98
3rd Target up-side 8.18
1st Target down-side 7.22
2nd Target down-side 7.02
3rd Target down-side 6.82
Siliconware Precision Industries Company, Ltd. ( NASDAQ USA Symbol : SPIL )
Sector : N/AIndustry:N/AFull Time Employees:N/ABusiness Summary Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services to semiconductor suppliers worldwide. Its packaging and testing solutions comprise substrate packa And Other Stocks in Same Sector
SPIL
7.36 0.04 (0.55 %)
LT : Sell
ST : Sell
SPIL Other Details
Segment EQ
Market Capital 3037607936.00
Sector N/AIndustry:N/AFull Time Employees:N/ABusiness Summary Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services to semiconductor suppliers worldwide. Its packaging and testing solutions comprise substrate packa
Industry N/AFull Time Employees:N/ABusiness Summary Siliconware Precision Industries Co., Ltd. provides
Offical website http://www.spil.com.tw
SPIL Address
SPIL
No. 123, Da Fong Road
Sec. 3
Taichung, 427
Taiwan
Phone: 886 4 2534 1525
Fax: 886 4 2534 2025
Interactive Technical Analysis Chart Siliconware Precision Industries Company, Ltd. ( SPIL NASDAQ USA )
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SPIL Business Profile
Siliconware Precision Industries Co., Ltd. is principally engaged in the provision of semiconductor packaging and testing services. The Company operates its businesses through packaging services, which deals with ball grid array (BGA) integrated circuits (ICs), flip-chip BGA ICs and other IC products; bumping services, which offers 8- and 12-inch wafer bumping; testing services, which deals with 8- and 12-inch wafer sort testing, final testing and system level testing, as well as other business, which offers flash memory cards and other products. During the year ended December 31, 2011, the Company obtained approximately 85% of its total revenue from packaging services. It operates its businesses primarily in Taiwan and North America.