CCMP Share Price

Open 62.78 Change Price %
High 63.47 1 Day -0.39 -0.62
Low 61.92 1 Week 2.75 4.61
Close 62.41 1 Month 5.59 9.84
Volume 146170 1 Year 20.86 50.20
52 Week High 63.47
52 Week Low 0.00
CCMP Important Levels
Resistance 2 63.85
Resistance 1 63.25
Pivot 62.60
Support 1 61.57
Support 2 60.97
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Cabot Microelectronics Corporation (NASDAQ: CCMP)

CCMP Technical Analysis 5
As on 9th Dec 2016 CCMP Share Price closed @ 62.41 and we RECOMMEND Strong Buy for LONG-TERM with Stoploss of 46.28 & Strong Buy for SHORT-TERM with Stoploss of 55.97 we also expect STOCK to react on Following IMPORTANT LEVELS.
CCMP Target for December
1st Target up-side 64.28
2nd Target up-side 67.58
3rd Target up-side 70.88
1st Target down-side 54.88
2nd Target down-side 51.58
3rd Target down-side 48.28
CCMP Other Details
Segment EQ
Market Capital 723564224.00
Sector Technology
Industry Semiconductor - Integrated Circuits
Offical website
CCMP Address
870 North Commons Drive
Aurora, IL 60504
United States
Phone: 630-375-5412
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CCMP Business Profile
Cabot Microelectronics Corporation (Cabot Microelectronics Corp), incorporated on October 6, 1999, is the supplier of polishing slurries and a CMP pad supplier used in the manufacture of advanced integrated circuit (IC) devices within the semiconductor industry, in a process called chemical mechanical planarization (CMP). CMP is a polishing process used by IC device manufacturers to planarize or flatten many of the multiple layers of material that are deposited upon silicon wafers in the production of advanced ICs. The Company develops, produces and sells CMP slurries for polishing many of the conducting and insulating materials used in IC devices, and also for polishing the disk substrates and magnetic heads used in hard disk drives. The Company also develops, manufacture and sells CMP polishing pads, which are used in conjunction with slurries in the CMP process. The Company develops, produce and sell CMP slurries for polishing a range of materials that conduct electrical signals, including tungsten, copper, tantalum and aluminum. Slurries for polishing tungsten are used heavily in the production of advanced memory and logic devices for a multitude of end applications, such as computers and servers, MP3 players, gaming devices, cell phones and digital cameras, and in mobile Internet devices such as smart phones and tablets, as well as in mature logic applications, such as those used in automobiles and communication devices. Slurries for polishing copper and barrier materials are used in the production of advanced IC logic devices such as microprocessors for computers, and devices for graphic systems, gaming systems and communication devices, as well as in the production of advanced memory devices. These products include different slurries for polishing the copper film and the thin barrier layer used to separate copper from the adjacent insulating material. The Company offers multiple products for each technology node to enables different integration schemes depending on specific customer needs. The Company also develops , manufacture and sells slurry products used to polish the dielectric insulating materials that separate conductive layers within logic and memory IC devices. The Company's core slurry products for these materials are primarily used for high volume applications called Interlayer Dielectric or ILD, and are used in the production of both older logic devices as well as in mature and advanced memory devices.