0522 Share Price

Open 115.00 Change Price %
High 116.00 1 Day -1.80 -1.56
Low 113.60 1 Week 2.20 1.97
Close 113.90 1 Month 17.15 17.73
Volume 1432232 1 Year 50.60 79.94
52 Week High 125.80
52 Week Low 62.00
0522 Important Levels
Resistance 2 116.12
Resistance 1 115.21
Pivot 114.50
Support 1 112.59
Support 2 111.68
HKG HongKong Most Active Stocks
0136 0.27 -10.00%
0582 0.13 8.33%
1988 7.48 -2.86%
0030 0.37 8.82%
0566 3.91 0.00%
1880 6.24 0.00%
1398 5.88 0.51%
3988 4.01 0.50%
0875 0.04 0.00%
0402 0.10 0.00%
More..
HKG HongKong Top Gainers Stocks
0730 0.32 28.00%
8028 0.05 25.00%
0186 0.51 24.39%
1638 6.30 20.46%
0379 0.06 20.00%
0195 0.12 20.00%
0835 0.06 20.00%
0907 2.47 19.32%
0285 24.85 16.39%
0343 0.52 15.56%
More..
HKG HongKong Top Losers Stocks
8351 0.43 -28.33%
8050 0.32 -21.95%
0770 0.92 -17.86%
2324 0.05 -16.67%
0736 0.05 -16.67%
8002 4.00 -15.97%
8120 0.06 -14.29%
0841 0.69 -11.54%
8270 0.08 -11.11%
8205 0.35 -10.26%
More..

ASM Pacific Technology Ltd. (HKG: 0522)

0522 Technical Analysis 4
As on 21st Sep 2017 0522 Share Price closed @ 113.90 and we RECOMMEND Strong Buy for LONG-TERM with Stoploss of 97.68 & Buy for SHORT-TERM with Stoploss of 104.96 we also expect STOCK to react on Following IMPORTANT LEVELS.
0522 Target for September
1st Target up-side 102.55
2nd Target up-side 106.58
3rd Target up-side 110.61
1st Target down-side 91.05
2nd Target down-side 87.02
3rd Target down-side 82.99
0522 Other Details
Segment EQ
Market Capital 0.00
Sector Technology
Industry Semiconductor Equipment & Materials
Offical website http://www.asmpacific.com
0522 Address
0522
Watson Centre
12th Floor
Kwai Chung,
Hong Kong
Phone: 852 2424 2021
Fax: 852 2481 3367
0522 Latest News
Interactive Technical Analysis Chart ASM Pacific Technology Ltd. ( 0522 HKG HongKong )
Java support must be enabled in order to display FnCharts.
You can download Java from http://www.java.com
Your Comments and Response on ASM Pacific Technology Ltd.
0522 Business Profile
ASM Pacific Technology Limited, an investment holding company, is engaged in the research and development, design, manufacture, and marketing of machines, tools, and materials used in the semiconductor and electronic assembly industries. It operates through three segments: Back-end Equipment, Surface Mount Technology Equipment, and Lead Frame. The company manufactures semiconductor assembly equipment and materials, such as etched and stamped leadframes used by multinational chip manufacturers, independent IC assembly houses, and consumer electronics manufacturers. It provides sorting solutions, die bonders, flip chip bonders, ball bonders, wedge bonders, dispensing/encapsulation and post encapsulation systems, test and finish solutions, automated optical inspection solutions, factory automation solutions, and lead frame solutions. The company also offers copper bonding, stacked die, advanced fine pitch, LED, and image sensor in-line assembly solutions; and support services. In addition, it is involved in the trade of semiconductor and surface mount technology equipment and materials; and the provision of marketing services. The company was founded in 1975 and is based in Kwai Chung, Hong Kong.